Packageless (COB) Technology

1.Thinner and smaller
By reducing height and width, COB enables thinner and smaller products.It enables LEDs luminescence in narrow areas and thin structures and also enables implementation in tight areas with a high degree of layout design freedom not constrained by space.Moreover, it facilitates smoother light-emitting designs on variously shaped substrates by allowing smaller sized elements to be mounted on curved surfaces and 3D shapes.

2.High density
COB offers high-density mounting with narrower spacing between elements.Its thin structure enables uniform luminescence and high-definition expression as well as smoother illumination without a dotty feel.

3.High heat dissipation
By mounting elements right on the substrate, COB efficiently dissipates heat directly to the substrate.By suppressing temperature rise in the LED elements and peripheral components, it reduces risk of failure and extends the service life of devices.

COB is utilized in various fields such as displays, automotive and industrial equipment, lighting applications, and more.

Displays

Automotive equipment

LED displays
We use the COB technology to achieve the high-density layout of tiny LEDs required for high-definition and smooth video expression.

Tail Lamps
We use the COB technology to enable high-density placement of high-power LEDs to accommodate the limited mounting area imposed by optical or visual design restrictions.